发明名称 Method of forming a metal gate electrode
摘要 The present invention includes a method of forming a metal gate electrode on which whiskers are not formed after performing a selective oxidation process and a subsequent heating process. The metal gate electrode is formed by forming a metal gate electrode pattern which is comprised of a polysilicon layer and a metal layer, and performing a selective oxidation process. After the selective oxidation process, the metal gate electrode undergoes a subsequent heating treatment. The selective oxidation process is carried out in a nitrogen containing gas ambient, so that a metal oxide layer is minimally formed on the metal layer. As a result, it is prevented from causing whiskers on the metal layer.
申请公布号 US6764961(B2) 申请公布日期 2004.07.20
申请号 US20010992980 申请日期 2001.11.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KU JA-HUM;CHO MAHN-HO;CHOI CHUL-JOON;HEO SEONG-JUN;CHO JUN-KYU
分类号 H01L21/28;H01L21/316;H01L21/321;H01L21/8234;H01L29/423;H01L29/43;H01L29/49;H01L29/78;(IPC1-7):H01L21/31 主分类号 H01L21/28
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