发明名称 |
Copper-nickel-silicon two phase quench substrate |
摘要 |
A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.
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申请公布号 |
US6764556(B2) |
申请公布日期 |
2004.07.20 |
申请号 |
US20020150382 |
申请日期 |
2002.05.17 |
申请人 |
MYOJIN SHINYA;BYE RICHARD L;DECRISTOFARO NICHOLAS J;LIN JENG S;MILLURE DAVID W;COX JR JOSEPH G;WALLS DALE R;SCHUSTER GARY B A |
发明人 |
MYOJIN SHINYA;BYE RICHARD L;DECRISTOFARO NICHOLAS J;LIN JENG S;MILLURE DAVID W;COX JR JOSEPH G;WALLS DALE R;SCHUSTER GARY B A |
分类号 |
B21J1/04;B21J5/00;B22D11/06;B22D21/00;C22C9/06;C22F1/00;C22F1/08;(IPC1-7):C22C9/06 |
主分类号 |
B21J1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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