发明名称 Copper-nickel-silicon two phase quench substrate
摘要 A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.
申请公布号 US6764556(B2) 申请公布日期 2004.07.20
申请号 US20020150382 申请日期 2002.05.17
申请人 MYOJIN SHINYA;BYE RICHARD L;DECRISTOFARO NICHOLAS J;LIN JENG S;MILLURE DAVID W;COX JR JOSEPH G;WALLS DALE R;SCHUSTER GARY B A 发明人 MYOJIN SHINYA;BYE RICHARD L;DECRISTOFARO NICHOLAS J;LIN JENG S;MILLURE DAVID W;COX JR JOSEPH G;WALLS DALE R;SCHUSTER GARY B A
分类号 B21J1/04;B21J5/00;B22D11/06;B22D21/00;C22C9/06;C22F1/00;C22F1/08;(IPC1-7):C22C9/06 主分类号 B21J1/04
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