| 摘要 |
A thermally curable material (including a conductive adhesive or solder) is formed on an electronic device support structure such as a die on a wafer or a printed wiring board (PWB). The support structure is placed on a heatable surface or placed in a process chamber having an infrared radiation (IR) mechanism. The thermally curable material is formed using a dispensing technique such as screen printing or pneumatic dispensing. To heat the curable material to a temperature sufficient to cure, the heatable surface can be heated or the IR mechanism can be activated. The heatable surface can be located in a screen printing machine. |
