| 摘要 |
A resist pattern in accordance with a predetermined pattern is formed on a substrate. Next, a bump resist mixed with a micro metallic powder is made thicker than the resist pattern and formed on the substrate formed with the resist pattern. Continuously, the bump resist on the resist pattern is removed in the bump resist. Next, the resist pattern is removed. As a result, a bump resist pattern corresponding to the predetermined pattern remains on the substrate. Furthermore, the resist component in this bump resist pattern is removed, thereby forming a micro bump (micro projecting electrode) 8 consisting of the micro metallic powder on the substrate. |
