发明名称 |
Wafer polishing method and wafer polishing device |
摘要 |
A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a polishing turn table, the wafer is held by vacuum-chucking the surface to be polished of the wafer such that a surface to be adhered of the wafer forms a convex surface in a vicinity including an arbitrary point in the surface to be adhered within a region surrounding a center of the surface to be adhered of the wafer, and the region being at least not less than 50% of an entire adhesion area; and the wafer is adhered to the wafer holding plate from a central portion of the surface to be adhered of the wafer. |
申请公布号 |
US6764392(B2) |
申请公布日期 |
2004.07.20 |
申请号 |
US20010913790 |
申请日期 |
2001.08.16 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
NIHONMATSU TAKASHI;KIDA TAKAHIRO;TANAKA TADAO |
分类号 |
B24B1/00;B24B37/04;B24B37/30;B24B41/06;B25B11/00;H01L21/304;H01L21/306;H01L21/683;(IPC1-7):B24B29/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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