发明名称 |
Semiconductor wafer, semiconductor device, and method for manufacturing the same |
摘要 |
A semiconductor wafer of the present invention includes: a plurality of semiconductor chip areas each of which is to be a semiconductor chip; and a cut-off area for separating the plurality of semiconductor chip areas from one another so as to obtain the semiconductor chips, wherein: an integrated circuit and an electrode pad connected to the integrated circuit are provided in each of the semiconductor chip areas; and a probe pad connected to the electrode pad is provided in the cut-off area.
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申请公布号 |
US6764879(B2) |
申请公布日期 |
2004.07.20 |
申请号 |
US20020200950 |
申请日期 |
2002.07.24 |
申请人 |
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发明人 |
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分类号 |
H01L21/301;H01L21/60;H01L23/528;H01L23/544;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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