SEMICONDUCTOR PROCESSING APPARATUS

摘要

PURPOSE: A semiconductor processing apparatus is provided to remarkably improve an operation speed of a semiconductor processing apparatus and reduce the volume of the semiconductor processing apparatus by decreasing a transfer distance of a wafer frame in the X-axis direction of a wafer frame transferring apparatus and a transfer distance of a semiconductor in the X-axis direction of the first transfer apparatus. CONSTITUTION: A work table(410) has a wafer frame mounting part(411). A Y-axis direction driving unit(420) transfers the work table in the Y-axis direction. A wafer frame clamping unit(430) selectively fixes the main body of a wafer frame placed on a wafer frame mounting part. A semiconductor separating pin(440) separates a semiconductor attached to tape of the wafer frame, disposed under the work table. A Z-axis direction driving unit(450) transfers the semiconductor separating pin in the Z-axis direction. An X-axis direction driving unit(460) transfers the Z-axis direction driving unit in the X-axis direction.