| 摘要 |
The present invention relates generally to heat sinks, and more particularly, to a heat sink attached to a circuit board for cooling components on the circuit board. A conventional glass-ceramic cook top has several electric heating units mounted below a glass-ceramic cooking plate. The cook top also has a circuit board to control the electric heating units. The circuit board is typically located below the glass-ceramic cooking plate. Most components on the circuit board, especially semiconductor components, are sensitive to high temperatures and must be kept below a maximum temperature to operate properly.
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