发明名称 |
INJECTION-MOLDED IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PURPOSE: An injection-molded image sensor and a method for manufacturing the same are provided to secure the image detector on a printed circuit board by using a solder tin. CONSTITUTION: A plurality of metal sheets(30) each of which includes a first board, a second board, a third board and a fourth board are arranged in a matrix. An injection-molded structure(32) having U-type shape includes a first and a second molding body and seals the metal sheets by injection-molding. The first board is exposed from the first molding body to form a signal input terminal. The second board is exposed from a lower portion of the first molding body to form a signal output terminal. A photosensitive chip(34) is mounted in a cavity of the injection-molded structure(32). A plurality of connecting pads are formed on the photosensitive chip(34). A plurality of wires(36) electrically connect the connecting pads to the signal input terminal. A transparent layer(38) seals the photosensitive chip by covering the first molding body.
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申请公布号 |
KR20040064080(A) |
申请公布日期 |
2004.07.16 |
申请号 |
KR20030001353 |
申请日期 |
2003.01.09 |
申请人 |
KINGPAK TECHNOLOGY INC. |
发明人 |
HSIEH JACKSON;WU JICHEN;TSAI WORRELL;CHEN BRUCE |
分类号 |
H01L27/14;(IPC1-7):H01L27/14 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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