METHOD FOR RESTRAINING HILLOCK OF ALUMINUM WIRING IN THERMAL PRINT HEAD

摘要

PURPOSE: A method for restraining hillock of an aluminum wiring in a TPH(Thermal Print Head) is provided to prevent hillock by previously forming a common wiring layer before forming a wiring layer. CONSTITUTION: A common wiring layer is selectively formed on a base substrate in order to restrain hillock seed(S11). A wiring layer is then formed on the base substrate including the common wiring layer(S13). Wiring patterns are formed by patterning the wiring layer(S15). A passivation layer is formed on the wiring patterns so as to restrain hillock seed under the low temperature of 100°C(S17).