| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for storage of electronic components from which an electronic device can be obtained with a high reliability on airtightness. SOLUTION: This package for storage of electronic parts possesses an insulating base 1 which has a recess 5 for mounting and housing electronic parts 4 at its topside, a metallized wiring conductor 6 which is led out from within the recess 5 of the insulating base 1 to the external surface, a metallized layer 7 for sealing which is made in frame form such that it surrounds the recess 5 at the topside of the insulating base 1, and a through hole 8 which is made inside the insulating base 1 and connects the metallized wiring conductor 6 with the metallized layer 7 for sealing, and for the through hole 8, the diameter grows larger gradually from the metallized layer 7 for sealing to the metallized wiring conductor 6. It becomes hard for the metallized paste 9 within the through conductor 8 to be pushed out toward the metallized layer 7 for sealing positioned above, thus this package can effectively prevent the deterioration of the flatness of the metallized layer 7 for sealing. COPYRIGHT: (C)2004,JPO&NCIPI
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