| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system capable of depositing a thin film of high quality on a substrate by eliminating contaminated sources in the sputtering. SOLUTION: The sputtering system 1 comprises the substrate 2, and a target 3 disposed facing the substrate, and includes an evacuatable film deposition chamber 5. The film deposition chamber is constituted so that the film deposition is performed by depositing particles produced by sputtering the target on a film deposition surface of the substrate. Components other than the substrate on which the particles in the film deposition chamber are deposited are roughened, and an oxidation film of at least one kind of metal oxide selected from a group consisting of Al, Ti, Mo, Cr, Fe, Ni and Cu, or an alloy containing at least one kind of the metal is deposited on the surface thereof. COPYRIGHT: (C)2004,JPO&NCIPI
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