Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder-printed layers

摘要

A solder paste printing method comprising the steps of dispose a plate-shaped mask having a plurality of through holes formed to correspond to a plurality of connection terminals, over a printed face of a substantially polygonal wiring substrate having a side of a length of at least 300 mm and having the connection terminals in the printed face; forming solder-printed layers by moving a squeezee along an outer face of the mask while holding the squeezee in contact with the outer face of the mask, thereby to fill the through holes with a solder paste; and detaching the mask by disengaging one side edge of the mask disposed over the printed face of the wiring substrate, relatively from the printed face.