发明名称 SUBSTRATE FOR POWER MODULE AND ITS PRODUCING PROCESS, AND POWER MODULE
摘要 PROBLEM TO BE SOLVED: To reduce the weight while improving the machinability, and to attain a sufficient strength while preventing warp. SOLUTION: A radiator 16 has a metallic main component 17 provided with a filler 18 having a low thermal expansion coefficient. The main component 17 is formed of a so-called high heat conducting material having a high thermal conductivity, e.g. Cu or a Cu alloy. The filler 18 is a linear body having an appropriate size composed of a metal, e.g. Invar alloy, having a thermal expansion coefficient smaller than that of the main component 17. The filler 18 is formed integrally with the main component 17 and oriented to a specified direction on a plane when the radiator 16 is formed. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200571(A) 申请公布日期 2004.07.15
申请号 JP20020369875 申请日期 2002.12.20
申请人 MITSUBISHI MATERIALS CORP 发明人 NAGASE TOSHIYUKI;NEGISHI TAKESHI;NAGATOMO YOSHIYUKI
分类号 H05K7/20;H01L23/36;H01L23/373;(IPC1-7):H01L23/36 主分类号 H05K7/20
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