发明名称 |
SUBSTRATE FOR POWER MODULE AND ITS PRODUCING PROCESS, AND POWER MODULE |
摘要 |
PROBLEM TO BE SOLVED: To reduce the weight while improving the machinability, and to attain a sufficient strength while preventing warp. SOLUTION: A radiator 16 has a metallic main component 17 provided with a filler 18 having a low thermal expansion coefficient. The main component 17 is formed of a so-called high heat conducting material having a high thermal conductivity, e.g. Cu or a Cu alloy. The filler 18 is a linear body having an appropriate size composed of a metal, e.g. Invar alloy, having a thermal expansion coefficient smaller than that of the main component 17. The filler 18 is formed integrally with the main component 17 and oriented to a specified direction on a plane when the radiator 16 is formed. COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004200571(A) |
申请公布日期 |
2004.07.15 |
申请号 |
JP20020369875 |
申请日期 |
2002.12.20 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
NAGASE TOSHIYUKI;NEGISHI TAKESHI;NAGATOMO YOSHIYUKI |
分类号 |
H05K7/20;H01L23/36;H01L23/373;(IPC1-7):H01L23/36 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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