| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a flexible rigid build-up wiring board, with which a part of a build-up layer is not necessary to be peeled after it is laminated on the flexible rigid printed wiring board. SOLUTION: The build-up layers (27) are worked prior to lamination to the flexible rigid printed wiring board (20). Parts (29) corresponding to parts (26) made to be cable connection parts (26) of the flexible rigid printed wiring board (20) are removed. Low flow-type resin is used as materials of the build-up layers (27). COPYRIGHT: (C)2004,JPO&NCIPI |
