| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield of a product by bonding an electronic part to a substrate with high bonding accuracy. SOLUTION: A flip-chip bonding apparatus, which has a bonding head 14 for receiving a chip 2 retrieved by a reversing unit 12 and bonding the chip 2 to the top surface of a substrate 1, comprising a first carrying means 22 which is positioned on the side for carrying in the substrate 1 and continuously carries the substrate 1 with a belt 26, a second carrying means 23 which is positioned on the side for carrying out the substrate 1 and continuously carries the substrate 1 with a belt 31, and a delivering means 24 which is positioned between the first carrying means 22 and the second carrying means 23, loads the substrate 1 on a bonding stage 36, and intermittently carries the substrate 1. COPYRIGHT: (C)2004,JPO&NCIPI
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