| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board for avoiding warpage and twisting. SOLUTION: In the printed-wiring board 1 where a wiring pattern region in which wiring patterns 20, 25 are formed, and a dummy pattern region in which a dummy pattern 30 is formed are provided on a substrate body 10, the dummy pattern 30 is formed in a plurality of circular patterns instead of a solid pattern, thus making nearly equal the remaining copper rate in the wiring pattern region to that in the dummy pattern region. COPYRIGHT: (C)2004,JPO&NCIPI
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