| 摘要 |
PROBLEM TO BE SOLVED: To reduce the forming space of a pad for placing a resistor as small as possible while a printed board is constituted so as to enable the specification in which an external device is connected to a high side and the specification in which the external device is connected to a low side to be commonly used. SOLUTION: The first pads 15(a, b) for placing the resistor R for contact current are formed. The second pads 16(a, b) for placing a jumper resistor R3 for connecting time to the high side and the third pads 17(a, b) for placing a jumper resistor R4 for connecting time to the low side are provided in a serial state. The one pad 16a or 17a of the second pads 16(a, b) and the third pads 17(a, b) is connected to the pad 15b of the side which is not connected to an input port p at the first pads 15(a, b). The other pad 16b of the second pads 16(a, b) is connected to a ground, and the other pad 17b of the third pads 17(a, b) is connected to a power supply side. COPYRIGHT: (C)2004,JPO&NCIPI
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