| 摘要 |
A semiconductor wafer, a method of marking a crystallographic direction on the semiconductor wafer, and a method of processing the marked semiconductor wafer are disclosed. The semiconductor wafer is marked with a scribe line, which in one embodiment is provided with a commercially available scribe tool that is used to cleave III-V type wafers and/or another apparatus that provides a line that is sufficiently narrow to be associated with cleaving the wafer exactly along a predetermined crystallographic plane. Accordingly, the line is also of sufficient narrowness to precisely mark the crystallographic direction. To ensure that the scribe line does not render the marked wafer susceptible to cleavage, the scribe line, or lines, are provided away from the edges of the wafer and with reasonable depths and/or lengths.
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