发明名称 |
Assemblies comprising molybdenum and aluminum; and methods of utilizing interlayers in forming target/backing plate assemblies |
摘要 |
The invention includes an assembly (130) having a physical vapor deposition target (102) separated from a backing plate (120) with a layer (104) consisting essentially of one or both of molybdenum and tantalum. The invention also includes an assembly comprising a backing plate of at least 99.9% aluminum bound to a target of at least 99.9% molybdenum through a bond having a strength of at least about 6,000 pounds per square inch (psi). Additionally, the invention includes a method of bonding a tungsten-containing material to an aluminum-containing material. A layer of molybdenum-containing material (104) is provided between the tungsten-containing material (102) and the aluminum-containing material (120); and is bonded to both the tungsten-containing material (102) and the aluminum-containing material (120).
|
申请公布号 |
US2004134776(A1) |
申请公布日期 |
2004.07.15 |
申请号 |
US20030475080 |
申请日期 |
2003.10.14 |
申请人 |
MISNER JOSH W.;MORALES DIANA;KELLER JEFF A. |
发明人 |
MISNER JOSH W.;MORALES DIANA;KELLER JEFF A. |
分类号 |
B23K20/02;B23K20/16;B23K20/233;C23C14/34;H01J37/34;H01L21/285;(IPC1-7):C23C14/34;B23K28/00 |
主分类号 |
B23K20/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|