| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device for quickly taking a proper measure by detecting separation of a polishing object from a polishing object holding mechanism in a short time. <P>SOLUTION: This polishing device has a polishing table 1 having a polishing surface and a top ring 4 for holding a polishing object base board W, and polishes by pushing the polishing object base board W held by the top ring 4 against the polishing surface of the polishing table 1, and is provided with sensors 8, 9 and 10 of combining either or two of a capacitance type sensor for detecting separation of the polishing object base board W by a change in capacitance between the sensor and a polishing table surface in one place or a plurality of places in the vicinity of the top ring 4 and an eddy current type sensor for detecting separation of the polishing object base board W by a change in electric resistance between the sensor and the polishing table surface. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
