发明名称 FLEXIBLE WIRING BOARD, SEMICONDUCTOR DEVICE USING THE SAME, AND ITS PACKAGED APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a flexible wiring board capable of preventing a disconnection in bending and achieving a folding of 180&deg; reliably. <P>SOLUTION: The flexible wiring board comprising a base material made of a flexible film and a wiring pattern formed on one side or both sides of the base material, is characterized by being equipped with a bending auxiliary section for facilitating bending with the edge line of the bending section as a boundary. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004200597(A) 申请公布日期 2004.07.15
申请号 JP20020370435 申请日期 2002.12.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAWABATA MICHIHITO;SAITO TORU
分类号 H01L25/18;H01L21/60;H01L25/065;H01L25/07;H01L25/10;H01L25/11 主分类号 H01L25/18
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