发明名称 |
FLEXIBLE WIRING BOARD, SEMICONDUCTOR DEVICE USING THE SAME, AND ITS PACKAGED APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible wiring board capable of preventing a disconnection in bending and achieving a folding of 180° reliably. <P>SOLUTION: The flexible wiring board comprising a base material made of a flexible film and a wiring pattern formed on one side or both sides of the base material, is characterized by being equipped with a bending auxiliary section for facilitating bending with the edge line of the bending section as a boundary. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004200597(A) |
申请公布日期 |
2004.07.15 |
申请号 |
JP20020370435 |
申请日期 |
2002.12.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KAWABATA MICHIHITO;SAITO TORU |
分类号 |
H01L25/18;H01L21/60;H01L25/065;H01L25/07;H01L25/10;H01L25/11 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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