| 发明名称 |
PROCESSING METHOD AND APPARATUS THEREOF |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a processing method and a processing apparatus, which are superior in productivity. <P>SOLUTION: A controller 100 enables wafers housed in cassettes C to be etched continuously in processing chambers 4. It is determined by the controller 100 on the basis of a measurement result obtained from a shape measurement unit 12 whether the wafers subjected to etching in the processing chambers 4 are defective or not. The controller 100 stops continuous processing of the wafers when a prescribed number of wafers are found defective in succession. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004200323(A) |
申请公布日期 |
2004.07.15 |
| 申请号 |
JP20020365777 |
申请日期 |
2002.12.17 |
| 申请人 |
TOKYO ELECTRON LTD |
发明人 |
OKUMOTO YASUHIRO;KARASAWA WATARU |
| 分类号 |
H01L21/66;G05B23/02;H01L21/00;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
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