| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress occurrence of a whisker and a crack sufficiently through a simple plating structure when a conductive layer for connection is formed on the surface of an external terminal by Pb free Sn based alloy plating, and to manage the composition of a metal forming a low melting point alloy with Sn strictly. <P>SOLUTION: The electronic component 10 being disclosed is provided, on the surface of a lead 2 serving as an external terminal, with a conductive layer 3 for connection composed of an Sn-Bi alloy where 0.5-6.0 wt% of Bi is added to Sn and having a single layer plating structure having a plating film thickness of 10-25 μm. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
