| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated semiconductor device, wherein a semiconductor chip is surely mounted on a substrate and packaging density is improved, while thinning the semiconductor chip-mounted substrate. <P>SOLUTION: The laminated semiconductor device has a multilayer substrate, comprising a plurality of substrates layered with insulating layers in between, with at least one semiconductor chip arranged in an insulating layer sandwiched between the substrates constituting the multilayer substrate, and contact pins electrically connecting pads on the semiconductor chip and connecting pads on the substrate facing the connecting pads on the semiconductor chip. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
