| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure for effectively guiding heat produced in a power semiconductor element in a power semiconductor module of a direct water cooling structure. <P>SOLUTION: The packaging structure of the water cooling power semiconductor module is adapted such that in the packaging structure of the water cooling power semiconductor module a plurality of plate shaped fins integral with a metal base are formed on an outer wall of the metal base. The structure is further adapted such that a distance between the centers of the adjacent plate shaped fins on a cross section of the plate shaped fins perpendicular to the face of the metal base and the faces of the plate shaped fins is more increased as they go away from the metal base, such that the plate shaped fins are disposed substantially radially around the power semiconductor element, and furthermore an interval between the counterfaces of the plate shaped fins is kept unchanged or narrowed as the fins go from a side of the fins close to the metal base, i.e., from the root of the fins to a side of the fins far away from the metal base, i.e., tip ends of the fins. Heat dissipation is hereby effectively achieved. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
