WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND MEMBER THEREFOR AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent deformation of the wiring board at the temperature near the soldering temperature without providing any base material for the reinforcement to an insulated substrate in the wiring board, in which the wiring is provided on the surface of the insulated substrate using a resin material or on the surface and interior of the same substrate. SOLUTION: The insulated substrate is formed as the wiring board comprising an oligomer type organic silicon compound which is generated with the reaction between the organic silicon compound expressed by the following chemical formula (R is an organic group including an functional group which shows additional reaction with the epoxy resin, and R' is a methyl group or ethyl group), a hardening agent which realize hardening through the additional reaction of the epoxy resin and the oligomer type organic silicon compound, and a resin material formed through thermal hardening of a mixture of the functional group which is easily coupled with hydrogen and a compound including the reactive unsaturated coupling. COPYRIGHT: (C)2004,JPO&NCIPI