| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a multilayer printed circuit board where variation in the thickness of an insulating layer is reduced. SOLUTION: In the method for producing a multilayer printed circuit board, an insulation film with a copper foil containing a stage-B resin of high resin fluidity is used for performing multilayered adhering by a vacuum pressure type laminator. COPYRIGHT: (C)2004,JPO&NCIPI |
