MANUFACTURING METHOD FOR MULTILAYER CIRCUIT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer circuit substrate to control the occurrence of a deformation and an interlayer peeling and to increase a dimensional accuracy by controlling a shrinkage in a face direction. SOLUTION: A laminate body formed by laminating a plurality of first insulating layers 1a to 1f consisting of first inorganic components and a plurality of second insulating layers 1g to 1k consisting of second inorganic components whose thicknesses are greater than the first insulating layers and initiates to shrink at higher temperature than that of the first insulating layers as heat is applied is heated at a first temperature range which is lower than the shrinkage initiating temperature of the second insulating layers and higher than the shrinkage initiating temperature of the first insulating layers. The first insulating layers 1a to 1f are largely shrunk in their thickness direction rather than in their face direction and then the laminate body is sintered shrinking the second insulating layers 1g to 1k in their thickness direction rather than in their face direction by heating the laminate body at a second temperature range which is higher than the shrinkage initiating temperature of the second insulating layers. COPYRIGHT: (C)2004,JPO&NCIPI