发明名称 |
LOWER PROFILE PACKAGE FOR AN INTEGRATED CIRCUIT WITH POWER SUPPLY IN PACKAGE |
摘要 |
A package (10) with a Power Supply In Package (PSIP) feature may include a charge pump (16) external to the die (14) in order to take advantage of a smaller die size. The die (14) may be mounted on a substrate with an array of solder balls (34) of a Ball Grid Array. The package (10) may have substantially the same size as a package without PSIP capability. In one embodiment, the passive components (16) may be mounted on the die (14) using epoxy (18). In another embodiment, the reduced-size passive components (32) may be mounted on the substrate (28) of the ball grid array (34) in a region (33) free of solder balls. |
申请公布号 |
WO03061005(A3) |
申请公布日期 |
2004.07.15 |
申请号 |
WO2002US39514 |
申请日期 |
2002.12.10 |
申请人 |
INTEL CORPORATION |
发明人 |
RABADAM, ELEANOR;FOEHRINGER, RICHARD |
分类号 |
H01L25/16 |
主分类号 |
H01L25/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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