发明名称 |
SUBSTRATE TREATMENT APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To effectively recover raw materials by enhancing a cooling efficiency. SOLUTION: The substrate treatment apparatus is provided with: a reaction chamber where a substrate is treated; an exhaust tube where exhaust gas is exhausted from the reaction chamber; a recovery means 40 provided at the exhaust tube, and where the exhaust gas is cooled to change the phase of a raw material in the exhaust gas, and the raw material is recovered. The recovery means is provided with a plurality of capillaries 52 shunting the exhaust gas flow at the inside of the recovery means. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004197182(A) |
申请公布日期 |
2004.07.15 |
申请号 |
JP20020368567 |
申请日期 |
2002.12.19 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
WADA TETSUYA;IKEDA FUMIHIDE |
分类号 |
C23C16/44;H01L21/285;H01L21/31;(IPC1-7):C23C16/44 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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