发明名称 Contact structure, display device and electronic device
摘要 A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented in an inspection before boding FPC. However, the protective conductive film has higher resistivity compared to the metal film; therefore, contact resistivity with FPC gets higher, and power consumption gets bigger in the condition of using the display device. The present invention provides a contact structure, wherein a structure of FPC contact is formed of a layered film of the metal film and the protective conductive film, and a conductive particle included in an anisotropic conductive film is formed of the protective conductive film in a slit shape having a space wider than a width necessary for an electrical connection with the metal film and a space narrower than a width of an electrode of an inspection apparatus and can be electrically connected with the FPC in both of the protective conductive film and the metal film, and a display device having the contact structure.
申请公布号 US2004135258(A1) 申请公布日期 2004.07.15
申请号 US20030741999 申请日期 2003.12.19
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 EBINE HIDEYUKI
分类号 G02F1/13;H05K1/11;H05K3/24;H05K3/32;H05K3/36;(IPC1-7):H01L23/48 主分类号 G02F1/13
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