发明名称 Thin-film cooling device for microprocessor, has solder paste applied via copper tube and two layers of copper gauze joined using heating plate
摘要 <p>Two layers of copper sheet (3,4), two layers of copper gauze (1,2) and a copper tube are welded together and vacuum degassed. Solder paste is applied form the end of the copper tube using a syringe, and the two layers of copper gauze are simultaneously joined using a heating plate. Air is degassed using a vacuum pump, and the cooling device is filled with water or methyl alcohol type heat-withstanding fluid. The cooling device is finally soldered and sealed.</p>
申请公布号 DE202004000914(U1) 申请公布日期 2004.07.15
申请号 DE20042000914U 申请日期 2004.01.22
申请人 LIN, YU-HSING 发明人
分类号 G06F1/20;H01L21/48;H01L23/36;H01L23/367;H01L23/373;(IPC1-7):G06F1/20 主分类号 G06F1/20
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