| 摘要 |
PROBLEM TO BE SOLVED: To provide an electro-optical device manufacturing method capable of sufficiently effectively sticking a semiconductor substrate to a supporting substrate and solving also a trouble which may be generated at the time of wet-etching a contact hole for fixing the potential of a light shielding layer at a controlled potential. SOLUTION: The method for manufacturing an electro-optical device using a composite substrate constituted of sticking a semiconductor substrate provided with a semiconductor layer to the surface of a supporting substrate is provided with a process for forming a 1st insulating layer 12B on the semiconductor substrate 208, a process for forming a recessed part 11b by patterning the 1st insulating layer 12B, a process for forming a light shielding layer material on the surface of the 1st insulating layer 12B forming the recessed part 11b in a state that the recessed part 11b is embedded, a process for forming a light shielding layer 11a in the recessed part 11b by polishing or etching back a light shielding layer material film 11 consisting of a light shielding layer material, and a process for sticking the surface side of the semiconductor substrate 208 on which the light shielding layer 11b is formed to the supporting substrate. COPYRIGHT: (C)2004,JPO&NCIPI |
