| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the uniform elongation and contraction of a wafer tape upon breaking a wafer after dicing. SOLUTION: A hot air outlet 55c is provided in an expand mechanism section 50 for the wafer tape so as to be faced to a peripheral rim area in a wafer ring 21 for the wafer tape supported by the wafer ring 21 as a tension reducing means to soften the wafer tape by heating. At the same time, a wafer mounting member with the wafer ring 21 thereon is rotated by a motor 53 to hit hot air, blown against a spot, against the whole inner peripheral rim of the wafer ring 21 for the wafer tape. The hot air is blown against the peripheral rim side of the wafer tape in such a manner that the wafer tape can be elongated or contracted uniformly. COPYRIGHT: (C)2004,JPO&NCIPI |
