| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame having improved solderability resistance, and a semiconductor device. SOLUTION: The lead frame for semiconductors is subjected to surface treatment by a finishing agent containing a disulfide compound, more preferably a disulfide compound expressed by a general expression (1). In the expression, R1, R2 indicate an alkyl group or an aryl group, where the number of carbons is 2-18. R1 and R2 may be the same or different. COPYRIGHT: (C)2004,JPO&NCIPI |
