| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the warping package and voids due to down-sizing of a semiconductor chip. SOLUTION: This semiconductor device comprises a semiconductor chip, a plurality of leads, conductive wires connecting between the leads and corresponding electrodes of the semiconductor chip, respectively, and a resin-made package for covering the semiconductor chip, parts of the leads, and the wires. Further, balancing parts for resin-balancing of the package are formed in part of a specific lead that is disposed in a region where the semiconductor chip does not occupy though inside the package. Furthermore, parts of the leads are bonded on the upper surface of the semiconductor chip with an insulating tape sandwiched between them to form LOC construction. In addition, the balancing parts are formed with branch leads branched from one lateral side of the specific lead, and at the middle of the respective branch leads, are bent toward the underside where the semiconductor chip lies. COPYRIGHT: (C)2004,JPO&NCIPI
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