| 摘要 |
PROBLEM TO BE SOLVED: To prevent non-bonding electronic components 3 from being bonded/fixed to a substrate 1 and to prevent the surface of a checker land 4 from being covered by adhesive 7 for fixing a bonding-type electronic component 2 to the substrate 1, in a circuit board assembly where one or a plurality of the bonding-type electronic components 2 and a plurality of the non-bonding-type electronic components 3 are arranged on the substrate 1. SOLUTION: In the circuit board assembly, peripheral walls 5 which surround one or a plurality of the non-bonding electronic components 3 adjacent to the bonding electronic components 2 and the checker land 4 and are formed of solder, are formed on the substrate 1. COPYRIGHT: (C)2004,JPO&NCIPI
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