| 摘要 |
A method for forming a conductive region on a first portion of a substrate, the method comprising exposing the first portion to a filtered beam of substantially fully ionised metallic ions under a pulsed, modulated electrical bias. The method uses FCVA (Filtered Cathodic Vacuum Arc) techniques to generate the filtered ion beam and permits the formation of a conformal metal coating, even in high aspect ratio vias and trenches. The method also permits the in-filling of vias and trenches to form conductive interconnects. Particular examples concern the deposition of copper ions. Also disclosed are an adapted FCVA apparatus for depositing metals on substrates and control apparatus for controlling ion beams impacting upon substrates, the control apparatus being suitable for incorporation within existing filtered on beam sources.
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