Compliant interposer assembly for wafer test and burn-in operations

摘要

In the invention a compliant interposer is provided that accommodates variations in contact height, contact location, and contact materials. The interposer is in direct contact in the interface between the contact surface of the IC under test and the fan out wiring surface of the test equipment and which carries interconnection ability that is compliant with respect to the interfaces. The interposer has structurally parallel contacting layers that are compressively held apart at a separation distance by a fame member that in turn has areas in which interconnect members can move in accommodating spatial variations in the IC and fan out contacts in the interface. Each layer of the interposer, that is to be in contact with the IC contacts and with the fan out contacts has comparable a pattern of holes for each end region of each interconnect conductor members. Those interconnect conductor members in turn send from each IC contact through one of the holes in the pattern in the IC interposer layer that is adjacent to the IC, pass through a bend in the movement area of the frame and then out through a corresponding hole in the pattern in the interposer layer adjacent to the fan out. Compliant capability is thus built into the interposer contact layers for adaptability at each interface.