| 发明名称 |
RELEASE SHEET FOR SEMICONDUCTOR MOULD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a release sheet which is easily peeled off from a package after molding a semiconductor package. SOLUTION: The release sheet comprising a base layer and a peel-off layer is provided with the peel-off layer containing resin particles of 1 to 30μm average particle size. COPYRIGHT: (C)2004,JPO&NCIPI
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| 申请公布号 |
JP2004200467(A) |
申请公布日期 |
2004.07.15 |
| 申请号 |
JP20020368100 |
申请日期 |
2002.12.19 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
IKETANI TAKUJI;YAMAMOTO OSAMU |
| 分类号 |
B32B27/00;H01L21/56;(IPC1-7):H01L21/56 |
主分类号 |
B32B27/00 |
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