| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for removing a solid residual or a liquid residual, or both of them, from an electronic component such as a semiconductor wafer or the like. SOLUTION: The residual is solidified on the surface of the wafer by the use of liquid or a supercritical carbon dioxide, and then the residual is removed by vaporization from the system. In a favorable embodiment, after the solidifying step and the vaporizing step are repeated (cycled), the CO<SB>2</SB>is removed from a vessel. The residual is removed with the vaporizing carbon dioxide. COPYRIGHT: (C)2004,JPO&NCIPI
|
