发明名称 BONDING METHOD OF SUBSTRATE AND BONDING APPARATUS THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a bonding method of substrate in which one side of substrate is moved with a relatively light force, two sheets of substrates are accurately aligned and the quality of the bonded two sheets of substrates is enhanced and to provide a bonding apparatus thereof. SOLUTION: A lower part retaining table 15 and a upper part retaining table 18 on which the substrates 3, 4 are respectively retained are driven in the direction of allowing the retaining tables to approach each other and the substrates are allowed to contact with each other via a liquid crystal 6 dropped on either one side substrate. Thereby, the substrate 3 retained on the lower part retaining table 15 is floated. Subsequently, the floated substrate 3 is brought into contact with the lower part retaining table 15, a contact load smaller than the bonding load when the substrates are bonded is applied to the two sheets of substrates and the horizontal alignment of the substrates is performed. Then the bonding load is applied to the aligned two sheets of substrates and the substrates are bonded with a sealant 5. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004199048(A) 申请公布日期 2004.07.15
申请号 JP20030403704 申请日期 2003.12.02
申请人 SHIBAURA MECHATRONICS CORP 发明人 MASUDA KOICHI;TAKAHASHI TAKASHI
分类号 G02F1/13;G02F1/1333;(IPC1-7):G02F1/13;G02F1/133 主分类号 G02F1/13
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