HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem that occurrence and short circuit or the like of whiskers arc induced when a two-layer conductive path is formed on a bybrid integrate circuit board with a lower layer conductive path is undercut and an upper layer electrode is formed into an overhang. SOLUTION: A conductive path 11 consists of a first conductive path 14 formed on a lower layer and a second conductive path 15 formed on an upper layer. The second conductive path 15 is composed of a material having an etching rate smaller than the first conductive path 14. The ratio of the film thickness X of the second conductive path 15 to the projecting length Y of an overhang 16 from the first conductive path 14 of the second conductive path 15 is restricted to 0