发明名称 COMPOSITION FOR REMOVING ADHESIVE OF CIRCUIT JOINT AND METHOD FOR REMOVING USING THE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition for removing, efficiently removing an adhesive on a part requiring repair and excellent in connection reliability, and to provide a method for removing. SOLUTION: The composition for removing comprises 100 pts. wt. mixed solvent of oxygen-containing organic solvent with a nitrogen-containing organic solvent and having≥110°C boiling point and 0.5-50 pts. wt. fine particles of a porous material insoluble in the above-mentioned solvents, and the method comprises wiping off and cleaning up the unneeded part with the composition for removing. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004197109(A) 申请公布日期 2004.07.15
申请号 JP20040068937 申请日期 2004.03.11
申请人 HITACHI CHEM CO LTD 发明人 TSUKAGOSHI ISAO;NAKAJIMA ATSUO;KOBAYASHI KOJI;HIROZAWA YUKIHISA;OGUCHI MISAO;MATSUOKA HIROSHI
分类号 C09J5/00;C09J163/00;C09J201/00;H01L21/60;H05K3/32;(IPC1-7):C09J5/00 主分类号 C09J5/00
代理机构 代理人
主权项
地址