发明名称 PROCESS FOR PRODUCING RESIN PARTICLE AND PROCESS FOR PRODUCING ANISOTROPIC CONDUCTIVE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a technique of producing resin particles which have high strength and do not break even under large compression deformation. SOLUTION: A process for producing the resin particles comprises heating a raw material liquid containing a radical-polymerizable substance and a polymerization initiator at a temperature not higher than the 10-hour half-life temperature of the polymerization initiator to cure the raw material liquid. The resin particles 30 produced by the process have a strength of at least 1,200 Pa and accordingly does not break even under such large deformation as to render the compression deformation ratio 60% or more. Thus, when joint terminals 43 and 47 are connected with an anisotpropic conductive adhesive film obtained by forming a conductive layer 36 on the surfaces of the resin particles to prepare conductive particles 37 and dispersing the conductive particles 37 into an adhesive material 38, the conductive particles 37 sandwiched between the joint terminals 43 and 47 are largely deformed to increase the contact area between the joint terminals 43 and 47 and the conductive particles 37, reducing the conduction resistance value. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004196889(A) 申请公布日期 2004.07.15
申请号 JP20020364922 申请日期 2002.12.17
申请人 SONY CHEM CORP 发明人 HAYASHI SHINICHI;KOJIMA RYOJI
分类号 C08J3/12;C08F2/00;C09J9/02;C09J11/00;C09J133/04;C09J133/14;(IPC1-7):C08F2/00 主分类号 C08J3/12
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