发明名称 MULTI-LAYER STRUCTURE AND PACKAGE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polystyrenic multi-layered structure excellent in an oil resistance and in recycling performance, and a package using the same. <P>SOLUTION: The multi-layered structure 10 comprises, a surface layer 1 made of a polyolefinic resin formed through a middle layer 2 on a substrate layer 3 of a polystyrenic resin, while the middle layer 2 comprises a compatibilizer, comprised of a block copolymer of an aromatic vinyl compound and a conjugated diene comprising a polystyrenic resin of 25-75 wt.%, a polyolefinic resin of 75-25 wt.%, having a bonded aromatic vinyl content of 30-80 wt.% and a double bond resulted from the conjugated diene of≥35% saturated by hydrogen, of 1-20 pts.wt. per 100 pts.wt. of the total of the polystyrenic resin and the polyolefinic resin. The substrate layer 3 may be formed of the polystyrenic resin and the polyolefinic resin. The multilayered structure 10 is superior in an oil resistivity and recycling performance, and is suitable to use as a packaging material for foodstuffs or medicines and a container 20 and a lid 30. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004195905(A) 申请公布日期 2004.07.15
申请号 JP20020369756 申请日期 2002.12.20
申请人 IDEMITSU UNITECH CO LTD 发明人 YAMADA TOYOKAZU;ITAYA HITOSHI;ARAI YASUSUKE
分类号 B65D1/00;B32B27/30;B32B27/32;B65D1/09;B65D65/40;C08L23/00;C08L25/04;C08L53/02;(IPC1-7):B32B27/30 主分类号 B65D1/00
代理机构 代理人
主权项
地址