| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film removing system capable of removing a thin film on all alignment marks put on a substrate under the same conditions. SOLUTION: The thin film removing system comprises a laser thin film removing section for removing a thin film in a rectangular area (an objective area for removing the thin film) on the surface of a wafer W through a laser ablation phenomenon by scanning that area with a laser beam image of slit shape, and a section for turning the wafer W by 90°in a plane. At first, a thin film in the objective area Ax for removing the thin film is removed by scanning the objective area Ax on an X mark Mx with the laser beam image of slit shape in the X direction and then the wafer W is turned by 90°. Subsequently, the thin film in the objective area Ay on a Y mark My is removed by scanning the objective area Ay in the X direction with a laser light image of the same shape as that used when the thin film is removed from the objective area Ax. COPYRIGHT: (C)2004,JPO&NCIPI |
