| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal plate for a wiring board, which is especially superior in thermal conductivity by forming a plate stack wherein a comparatively thick metal plate for lamination wiring, such as a metal plate for a metal core print wiring and a metal plate for a large-current wiring board is used, and a laminated plate is formed by bonding resin on the whole surface or a portion of the metal plate. SOLUTION: On a surface of the metal plate of 0.1mm or larger thickness, the metal plate for lamination wiring consists of a first coarsening surface, constituted of many protruded parts of mean grain diameter of 1-30μm, partitioned by recessed parts formed by selectively etching a part of the metal plate surface, and a second coarsening surface, wherein fine particles of mean grain diameter of 0.1-10μm are formed on the whole surface or a part of the protruded parts or the recessed parts of the first coarsening surface through electrodeposition, The plate stack is formed by bonding the whole surface or a part of the metal plate surface, where the first and the second coarsening surfaces are formed to resin. COPYRIGHT: (C)2004,JPO&NCIPI
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