| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board that has high heat radiation and is highly reliable and that does not have malfunctions of an optical semiconductor component due to thermal loading. SOLUTION: The wiring board is provided with a first conductor layer 3 on the upper main surface of a substrate 2 made of silicon carbide, on which an optical semiconductor component is mounted, and a second conductor layer 4 that is electrically connected via an electrode and a bonding wire that are formed on the upper surface of the optical semiconductor component adjacent to the first conductor layer 3, between the substrate 2 and the first conductor layer 3 with an insulation layer 6 in-between. A third conductor layer 7 for external connection is formed on substantially the entire surface of a lower main surface of the substrate 2. COPYRIGHT: (C)2004,JPO&NCIPI
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